The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2024

Filed:

May. 14, 2021
Applicant:

Mitsubishi Heavy Industries, Ltd., Tokyo, JP;

Inventor:

Makoto Saito, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01K 7/02 (2021.01); H10N 10/00 (2023.01); H10N 10/01 (2023.01); H10N 10/10 (2023.01); H10N 10/80 (2023.01); H10N 10/817 (2023.01); B23K 20/16 (2006.01); B23K 103/24 (2006.01);
U.S. Cl.
CPC ...
G01K 7/02 (2013.01); H10N 10/00 (2023.02); H10N 10/01 (2023.02); H10N 10/10 (2023.02); H10N 10/80 (2023.02); H10N 10/817 (2023.02); B23K 20/16 (2013.01); B23K 2103/24 (2018.08);
Abstract

A structure and a method for mounting thermocouple on an intermetallic compounds such as TiAl by suppressing occurrence of cracks are provided. A thermocouple mounting structure is provided with a substrate, a coating formed on the substrate and a foil joined on the coating, and sandwiches a thermocouple between the substrate and the foil. A thermocouple mounting method includes forming a coating on a substrate and welding a foil on the coating, and the welding includes arranging a thermocouple so that the substrate and the foil sandwiches the thermocouple. Occurrence of cracks in the substrate formed with intermetallic compounds can be suppressed by providing a thermal spray coating between the substrate and the foil.


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