The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2024

Filed:

Jun. 09, 2020
Applicant:

Hitachi Astemo, Ltd., Hitachinaka, JP;

Inventors:

Hiroshi Nakano, Tokyo, JP;

Masahiro Matsumoto, Tokyo, JP;

Yasuo Onose, Hitachinaka, JP;

Kazuhiro Ohta, Hitachinaka, JP;

Assignee:

HITACHI ASTEMO, LTD., Ibaraki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01F 1/692 (2006.01); G01N 27/18 (2006.01);
U.S. Cl.
CPC ...
G01F 1/692 (2013.01); G01N 27/18 (2013.01);
Abstract

A thermal sensor device capable of maintaining measurement accuracy for a long period by suppressing plastic deformation due to thermal expansion of the heat generating resistor and reducing resistance change of the heat generating resistor, includes: a substrate having an opening; and a diaphragm having a structure in which a lower film, a heat generating resistor, and an upper film are stacked so as to bridge the opening, in which a film thickness of the lower film is larger than a film thickness of the upper film, an average thermal expansion coefficient of the lower film is larger than an average thermal expansion coefficient of the upper film, the lower film includes a plurality of films having different thermal expansion coefficients, and a film having a largest thermal expansion coefficient among the plurality of films is formed below a thickness center of the lower film.


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