The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2024

Filed:

May. 20, 2021
Applicant:

Lumileds Llc, San Jose, CA (US);

Inventors:

Nicola Bettina Pfeffer, Eindhoven, NL;

Frederic Stephane Diana, Santa Clara, CA (US);

Kevin-Gx Jiao, Shanghai, CN;

Charles André Schrama, San Jose, CA (US);

Arjen Gerben Van der Sijde, Eindhoven, NL;

Alan Andrew McReynolds, Los Altos, CA (US);

Yifeng Qiu, San Jose, CA (US);

Assignee:

Lumileds LLC, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 23/00 (2015.01); F21S 4/22 (2016.01); G03B 15/03 (2021.01); H04M 1/02 (2006.01); H04N 23/56 (2023.01); H04N 23/57 (2023.01); H05B 45/30 (2020.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21V 23/005 (2013.01); F21S 4/22 (2016.01); G03B 15/03 (2013.01); H04M 1/0264 (2013.01); H04N 23/56 (2023.01); H04N 23/57 (2023.01); H05B 45/30 (2020.01); F21Y 2115/10 (2016.08); G03B 2215/0567 (2013.01);
Abstract

A LED lighting module is described that is realized as a printed circuit assembly. The LED lighting module has a carrier with a strip of dielectric material and conductive circuit tracks printed on the dielectric material. Bare LED dies are mounted in a linear formation on the carrier. The width of the LED die formation does not exceed 0.75 mm and the area of the emission face of an LED die does not exceed 0.0625 mm2. Drivers are mounted on the carrier and are connected to drive the LED dies.


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