The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2024

Filed:

Nov. 12, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

David K. Carlson, San Jose, CA (US);

Stephen Moffatt, St. Brelade, JE;

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/48 (2006.01); C23C 14/34 (2006.01); C23C 14/54 (2006.01); C23C 16/52 (2006.01); H01L 21/268 (2006.01);
U.S. Cl.
CPC ...
C23C 16/482 (2013.01); C23C 14/3435 (2013.01); C23C 14/541 (2013.01); C23C 16/52 (2013.01); H01L 21/2686 (2013.01);
Abstract

Embodiments of the present disclosure generally relate to semiconductor processing, and specifically to methods and apparatus for surface modification of substrates. In an embodiment, a substrate modification method is provided. The method includes positioning a substrate within a processing chamber; and depositing a material on a portion of the substrate by a deposition process, wherein the deposition process comprises: thermally heating the substrate to a temperature of less than about 500° C.; delivering a first electromagnetic energy from an electromagnetic energy source to the substrate to modify a first region of the substrate, the first region of the substrate being at or near an upper surface of the substrate; and depositing a first material on the first region while delivering the first electromagnetic energy.


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