The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2024

Filed:

Sep. 06, 2018
Applicant:

Dow Toray Co., Ltd., Tokyo, JP;

Inventors:

Hiroshi Fukui, Ichihara, JP;

Kyoko Toyama, Ichihara, JP;

Masayasu Akasaka, Ichihara, JP;

Assignee:

DOW TORAY CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 83/04 (2006.01); B32B 7/06 (2019.01); B32B 7/12 (2006.01); B32B 27/28 (2006.01); B32B 37/12 (2006.01); B32B 37/18 (2006.01); B32B 38/10 (2006.01); C08J 5/18 (2006.01); C09J 7/29 (2018.01);
U.S. Cl.
CPC ...
C08L 83/04 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 27/283 (2013.01); B32B 37/12 (2013.01); B32B 37/182 (2013.01); B32B 38/10 (2013.01); C08J 5/18 (2013.01); C09J 7/29 (2018.01); B32B 2457/00 (2013.01); C08J 2383/04 (2013.01); C08L 2205/025 (2013.01); C08L 2205/035 (2013.01); C09J 2483/00 (2013.01);
Abstract

A silicone elastomer cured product having radical reactivity obtained by curing a composition is disclosed. The composition comprises (A) a chain organopolysiloxane having a curing reactive group, and optionally (B) an organohydrogen polysiloxane, (C1) a curing agent, and (D) an organopolysiloxane resin. The surface of the cured product has radical reactivity with, for example, an adhesive, and is easily removable along with, for example, adhesive tape after use as a protective material. In general, the cured product has excellent heat resistance and flexibility and exhibits good adhesion and conformity to a substrate so as not to separate from a substrate even when the cured product is cut together with the substrate while remaining easily removable from the substrate when desired. A protective material for an electronic component made of the cured product is also disclosed.


Find Patent Forward Citations

Loading…