The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2024

Filed:

Mar. 04, 2021
Applicant:

Ask Chemicals Llc, Wilmington, DE (US);

Inventors:

Sritama Kar, Dublin, OH (US);

Christian Priebe, Wuelfrath, DE;

Assignee:

ASK Chemicals LLC, Wilmington, DE (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/02 (2006.01); B22C 1/02 (2006.01); B22C 1/22 (2006.01); B22C 7/00 (2006.01); C08G 59/20 (2006.01); C08G 59/24 (2006.01); C08G 59/32 (2006.01); C08G 59/36 (2006.01); C08G 59/38 (2006.01); C08G 59/40 (2006.01); C08L 63/04 (2006.01); C08L 63/10 (2006.01);
U.S. Cl.
CPC ...
C08L 63/10 (2013.01); B22C 1/222 (2013.01); B22C 1/226 (2013.01); B22C 7/00 (2013.01); C08G 59/20 (2013.01); C08G 59/4064 (2013.01); C08L 2201/08 (2013.01); C08L 2205/025 (2013.01);
Abstract

A release agent is disclosed for use with an organic binder system used in metal casting. The binder system has a Part I component including an epoxy resin and a free radical initiator and a Part II component having an epoxy resin and an acrylate, where the Part I and Part II components are kept separate until the time of use. The release agent will typically have a molecular weight in the range of 150 to 160, with eight to ten carbon atoms. Two examples of the epoxide are pinene oxide and decene-1 oxide, each of which is effective as an internal release agent when present in the binder for a cold box process in the range of about 0.15% to about 1% of the total weight of the Part I and Part II components.


Find Patent Forward Citations

Loading…