The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2024
Filed:
Mar. 25, 2020
Applicant:
Sekisui Kasei Co., Ltd., Osaka, JP;
Inventors:
Assignee:
SEKISUI KASEI CO., LTD., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/18 (2006.01); B32B 27/06 (2006.01); B32B 27/36 (2006.01); C08J 9/14 (2006.01);
U.S. Cl.
CPC ...
C08J 9/141 (2013.01); B32B 5/18 (2013.01); B32B 27/065 (2013.01); B32B 27/36 (2013.01); B32B 2266/0264 (2013.01); B32B 2266/06 (2013.01); B32B 2307/538 (2013.01); B32B 2307/546 (2013.01); B32B 2307/7163 (2013.01); B32B 2307/732 (2013.01); C08J 2367/02 (2013.01);
Abstract
The present invention provides a laminated expanded sheet excellent in strength and formability. More specifically, the present invention relates to a laminated expanded sheet comprising a laminate of a resin expanded layer and a resin non-expanded layer, wherein the resin expanded layer is provided as an outermost layer, the laminated expanded sheet has a bending strength of 5 MPa or more, and an arithmetic average roughness of a surface formed of the resin expanded layer is 3 μm or more and 10 μm or less.