The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2024
Filed:
Mar. 23, 2022
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Takahiro Kanegae, Shiojiri, JP;
Katsuhiro Okubo, Azumino, JP;
Kentaro Murakami, Matsumoto, JP;
Shingo Tomimatsu, Shiojiri, JP;
Hiroki Kobayashi, Matsumoto, JP;
Haruhisa Uezawa, Shiojiri, JP;
Assignee:
SEIKO EPSON CORPORATION, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/15 (2006.01); B41J 2/14 (2006.01);
U.S. Cl.
CPC ...
B41J 2/15 (2013.01); B41J 2/14233 (2013.01); B41J 2002/14306 (2013.01);
Abstract
A liquid ejecting head includes: a plurality of head chips having a nozzle surface; a thermally conductive holder holding the plurality of head chips; a thermally conductive flow path structure provided with a flow path of a liquid supplied to the plurality of head chips; and a planar heater disposed between the holder and the flow path structure and along a direction parallel to the nozzle surface, in which the heater overlaps the plurality of head chips in a plan view.