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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11981114 B1

PDFFull Text
Date of Patent:
May. 14, 2024

Filed:

Jul. 09, 2021

Method of manufacturing sandwich panel and sandwich panel

Applicant:

Sumitomo Bakelite Co., Ltd., Tokyo, JP;

Inventor:

Masao Uesaka, Tokyo, JP;

Assignee:

SUMITOMO BAKELITE CO., LTD., Tokyo, JP;

Attorney:

WHDA, LLP

Primary Examiner:

Scott W Dodds

Int. Cl.
CPC ...
B32B 3/12 (2006.01); B29C 37/00 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01); B32B 7/12 (2006.01); B32B 27/12 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); B32B 37/12 (2006.01);
U.S. Cl.
CPC ...
B32B 37/1207 (2013.01); B29C 37/0075 (2013.01); B32B 3/12 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 5/26 (2013.01); B32B 7/12 (2013.01); B32B 27/12 (2013.01); B32B 27/302 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 2037/1223 (2013.01); B32B 2250/05 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/0269 (2013.01); B32B 2262/101 (2013.01); B32B 2305/024 (2013.01); B32B 2305/188 (2013.01); B32B 2307/54 (2013.01); B32B 2307/7376 (2023.05); B32B 2307/748 (2013.01); B32B 2309/02 (2013.01); B32B 2309/12 (2013.01); B32B 2323/10 (2013.01); B32B 2355/00 (2013.01); B32B 2367/00 (2013.01); B32B 2377/00 (2013.01); B32B 2605/18 (2013.01); B32B 2607/00 (2013.01);
Abstract

A method of manufacturing a sandwich panel () includes: a step of preparing a plurality of sheet-like prepregs (); a step of performing a first heating and pressurization process through a release film () on upper and lower surfaces of a laminate where the plurality of prepregs () are laminated such that the laminate is integrated to obtain a composite facing material (); and a step of disposing the composite facing material () on each of an upper surface side and a lower surface side of a sheet-like core layer () having a honeycomb structure and integrating the laminate through a second heating and pressurization process, in which a pressure of the first heating and pressurization process is higher than or equal to a pressure of the second heating and pressurization process.

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