The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2024
Filed:
Feb. 28, 2022
Applicant:
Hitachi Metals, Ltd., Tokyo, JP;
Inventor:
Shinji Yamamoto, Suita, JP;
Assignee:
PROTERIAL, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/00 (2006.01); B23K 20/04 (2006.01); B32B 15/01 (2006.01); B23K 103/04 (2006.01); B23K 103/12 (2006.01); B23K 103/22 (2006.01); H05K 5/04 (2006.01);
U.S. Cl.
CPC ...
B32B 15/015 (2013.01); B23K 20/04 (2013.01); B23K 2103/05 (2018.08); B23K 2103/12 (2018.08); B23K 2103/22 (2018.08); H05K 5/04 (2013.01);
Abstract
The method is for manufacturing a clad material (), which includes: clad rolling for rolling and bonding a first metal plate () made of stainless steel, a second metal plate () made of Cu or a Cu alloy, and a third metal plate () made of stainless steel in a state in which the first metal plate, the second metal plate, and the third metal plate are stacked in this order. The clad rolling is performed with a pressure-bonding load of 4.4×10N/mm or more. The second layer is made of Cu or a Cu alloy. The third layer is made of stainless steel. The clad material has an overall thickness of 1 mm or less.