The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2024

Filed:

Dec. 10, 2019
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Wei Huang, Palo Alto, CA (US);

Gary J Dispoto, Palo Alto, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/393 (2017.01); B22F 5/00 (2006.01); B22F 10/20 (2021.01); B22F 10/85 (2021.01); B29C 64/141 (2017.01); B33Y 10/00 (2015.01); B33Y 50/02 (2015.01);
U.S. Cl.
CPC ...
B29C 64/393 (2017.08); B22F 5/003 (2013.01); B22F 10/20 (2021.01); B22F 10/85 (2021.01); B29C 64/141 (2017.08); B33Y 10/00 (2014.12); B33Y 50/02 (2014.12);
Abstract

In one example in accordance with the present disclosure, a system is described. The system includes a fracture channel controller to determine fracture channels for a three-dimensional (3D) printed object. Portions of the 3D printed object along fracture channels are to be solidified to a lesser degree as compared to non-channel portions of the 3D printed object. The system also includes an additive manufacturing controller to control an additive manufacturing device. The additive manufacturing controller controls the additive manufacturing device to 1) solidify portions of a layer of powdered build material to form a slice of the 3D printed object and 2) selectively solidify fracture channels in the slice, wherein the fracture channels are solidified to a lesser degree as compared to non-channel portions.


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