The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2024
Filed:
Dec. 06, 2018
Konica Minolta, Inc., Tokyo, JP;
Kazuya Isobe, Tokyo, JP;
KONICA MINOLTA, INC., Tokyo, JP;
Abstract
The present invention addresses the problem of providing a powder material that has good wettability with respect to an aqueous solvent and that can be applied to a method for producing a three-dimensional molded object in which a bonding fluid and a peeling fluid are applied. In order to solve the abovementioned problem, a powder material according to the present invention is used in a method for a producing a three-dimensional molded object that includes formation of a thin layer containing the powder material, application of a bonding fluid containing an aqueous solvent and an energy-absorbing agent to the thin layer, and irradiation of the thin layer with energy. The powder material contains molding particles comprising: resin particles containing a thermoplastic resin; and an organic resin layer that is arranged around the resin particles and that contains an organic resin having a surface tension of 30-45 mN/m.