The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2024

Filed:

Oct. 18, 2021
Applicant:

Teledyne Flir Commercial Systems, Inc., Goleta, CA (US);

Inventors:

Marcel Tremblay, Goleta, CA (US);

Jace Dispenza, Golden, CO (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); B29C 45/00 (2006.01); B29K 77/00 (2006.01); B29L 31/30 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14778 (2013.01); B29C 45/0001 (2013.01); B29C 45/14639 (2013.01); B29K 2077/00 (2013.01); B29L 2031/30 (2013.01); B29L 2031/3481 (2013.01);
Abstract

Various techniques are provided to enclose at least a portion of a thermal imaging system in a thermoplastic material to create a waterproof thermal imaging system and encapsulate associated electrical components. In one example, a method includes placing at least a portion of a thermal imaging system comprising a plurality of exposed electronic components into a mold. The method also includes injecting a thermoplastic material into the mold to deposit the thermoplastic material onto the electronic components and encapsulate the electronic components in an overmolded solid enclosure formed by the thermoplastic material. Additional methods and systems are also provided.


Find Patent Forward Citations

Loading…