The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2024
Filed:
Dec. 09, 2019
Nippon Closures Co., Ltd., Tokyo, JP;
Toyo Seikan Group Engineering Co., Ltd., Kanagawa, JP;
Akio Sato, Tokyo, JP;
Yoshihiro Kaitsuka, Kanagawa, JP;
Shin Nakamura, Kanagawa, JP;
Keitaro Hayashi, Kanagawa, JP;
Hiroshi Takahashi, Kanagawa, JP;
Mitsuo Kumata, Kanagawa, JP;
Yukihito Nozaki, Kanagawa, JP;
Tomoho Kikuchi, Kanagawa, JP;
Kunihiko Hatazawa, Kanagawa, JP;
NIPPON CLOSURES CO., LTD., Tokyo, JP;
TOYO SEIKAN GROUP ENGINEERING CO., LTD., Kanagawa, JP;
Abstract
A compression molding device, which can obtain a high compression molding force without lowering the efficiency of article production, and whose molding means has a long service life, is provided. In the compression molding device, a one-side mold assembly moving means () includes a toggle link mechanism including two links () and (), and a toggle link mechanism operating means (), while an opposite-side mold assembly moving means () includes a hydraulic cylinder mechanism. When a one-side mold assembly () and an opposite-side mold assembly () are to be brought from an open state into a closed state, the one-side mold assembly () is first moved to a nearly closed state by the one-side mold assembly moving means (), and then the opposite-side mold assembly () is moved from the nearly closed state to the closed state by the opposite-side mold assembly moving means ().