The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2024

Filed:

Nov. 08, 2019
Applicant:

Koninklijke Philips N.v., Eindhoven, NL;

Inventor:

Marcus Antonius Verschuuren, Berkel-Enschot, NL;

Assignee:

Koninklijke Philips N.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 33/24 (2006.01); B29C 33/42 (2006.01); B29C 59/00 (2006.01); B29C 59/02 (2006.01); B29C 37/00 (2006.01);
U.S. Cl.
CPC ...
B29C 33/24 (2013.01); B29C 33/424 (2013.01); B29C 59/002 (2013.01); B29C 59/026 (2013.01); B29C 2033/426 (2013.01); B29C 2037/90 (2013.01);
Abstract

A method of imprinting a substrate (), comprising affixing a flexible stamp () carrying an imprinting pattern () to a first carrier () comprising an array of apertures () which, by gas pressure, either pull the flexible stamp towards the first carrier or push it away; pushing it to a second carrier () carrying a substrate () with a resist layer (), leaving a gap () for creating a controllable contact area between the flexible stamp and the substrate and space () between the first carrier and the flexible stamp; progressively pushing areas of the flexible stamp into the resist layer to imprint it; developing the resist layer; and progressively releasing the flexible stamp by applying suction through successive apertures whilst controlling the inward flow of gas to the space () through the apertures that are not yet under suction in order to maintain the space () there above ambient but below a predetermined maximum pressure.


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