The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2024
Filed:
Jul. 05, 2019
Matsumoto Yushi-seiyaku Co., Ltd., Yao, JP;
MATSUMOTO YUSHI-SEIYAKU CO., LTD., Yao, JP;
Abstract
Heat-expandable microspheres containing a thermoplastic resin shell and a thermally-vaporizable blowing agent encapsulated therein. The thermoplastic resin is a polymer of a polymerizable component containing acrylonitrile, methacrylonitrile and acrylate ester and which satisfies specific conditions 1 and 2, where Condition 1: the amount of the acrylonitrile (A)<the amount of the methacrylonitrile (B), and Condition 2: the total amount of the acrylonitrile (A), the methacrylonitrile (B) and the acrylate ester (C) in the polymerizable component ranges from 61 to 100 wt %. Also disclosed are hollow resin particles manufactured by expanding the heat-expandable microspheres, a composition containing a base component and at least one selected from the heat-expandable microspheres and the hollow resin particles, and a formed article manufactured by forming or molding the composition.