The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2024
Filed:
Feb. 14, 2022
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Shuichi Takizawa, Tokyo, JP;
Atsushi Yoshino, Tokyo, JP;
Yuki Okino, Tokyo, JP;
Hiromu Harada, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 1/141 (2013.01); H05K 1/181 (2013.01); H05K 3/284 (2013.01); H05K 3/368 (2013.01);
Abstract
Disclosed herein is an electric circuit module that includes a circuit board, an electronic component mounted on an upper surface of the circuit board, and a mold member that covers the upper and side surfaces of the circuit board. The lower area of the side surface of the circuit board is exposed so as not to be covered with the mold member.