The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2024

Filed:

Jul. 04, 2019
Applicant:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Maki Ikebe, Osaka, JP;

Koji Nitta, Osaka, JP;

Shoichiro Sakai, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); C25D 3/38 (2006.01); C25D 7/00 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); C25D 3/38 (2013.01); C25D 7/00 (2013.01); H05K 3/188 (2013.01);
Abstract

A printed wiring board includes an electrically insulating base film, and an electrically conductive pattern stacked on at least one surface side of the base film. An average width of multiple wiring portions included in the electrically conductive pattern is 5 μm or greater and 20 μm or less. Each of the wiring portions includes a seed layer and a plating layer. The plating layer includes copper crystal planes of a (111) plane, a (200) plane, a (220) plane, and a (311) plane. An intensity ratio IRof an X-ray diffraction intensity of the copper crystal plane (220) obtained by Equation (1) below is 0.05 or greater and 0.14 or less,/()  (1)(where I, I, I, Iare respectively X-ray diffraction intensity of the (111) plane (200) plane, the (220) plane, and the (311) plane).


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