The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2024
Filed:
Jul. 29, 2021
Applicant:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Inventor:
Hisanori Murase, Kyoto, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 9/05 (2006.01); H03F 1/56 (2006.01); H03F 3/195 (2006.01); H03F 3/24 (2006.01); H03H 9/54 (2006.01);
U.S. Cl.
CPC ...
H03H 9/0566 (2013.01); H03F 1/565 (2013.01); H03F 3/195 (2013.01); H03F 3/245 (2013.01); H03H 9/542 (2013.01); H03F 2200/294 (2013.01); H03F 2200/318 (2013.01); H03F 2200/451 (2013.01);
Abstract
A high-frequency module () includes a mounting substrate (), a duplexer (L) arranged on the mounting substrate (), a duplexer (H) arranged on the mounting substrate () and having a pass band with a higher frequency than a pass band of the duplexer (L), and a semiconductor control IC () arranged on the mounting substrate () and stacked with the duplexer (L) of the duplexers (L andH).