The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2024

Filed:

Jun. 28, 2021
Applicant:

Quanzhou Sanan Semiconductor Technology Co., Ltd., Fujian, CN;

Inventors:

Chen-ke Hsu, Fujian, CN;

Changchin Yu, Fujian, CN;

Zhaowu Huang, Fujian, CN;

Junpeng Shi, Fujian, CN;

Weng-Tack Wong, Fujian, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/60 (2010.01); H01L 33/50 (2010.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 33/507 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01);
Abstract

A light-emitting device includes a lead frame, a light-emitting diode (LED) chip, and an encapsulant. The LED chip is disposed on the lead frame, and includes a substrate, a semiconductor light-emitting unit disposed on a surface of the substrate, and a first electrode and a second electrode, which are disposed on the surface of the substrate, and which are located outwardly of the semiconductor light-emitting unit. The first and second electrodes are electrically connected to a lower surface of the semiconductor light-emitting unit, and are respectively connected to a first wiring bonding region and a second wiring bonding region on the lead frame. The encapsulant encapsulates the LED chip on the lead frame.


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