The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2024

Filed:

Dec. 13, 2017
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Rakesh Dimri, Bangalore, IN;

Senthil Kumar Sundaramoorthy, Bangalore, IN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/118 (2006.01); H01L 21/8234 (2006.01); H01L 21/8238 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11807 (2013.01); H01L 21/823828 (2013.01); H01L 21/823871 (2013.01); H01L 23/5221 (2013.01); H01L 23/5286 (2013.01); H01L 23/53271 (2013.01); H01L 27/0207 (2013.01); H01L 21/823475 (2013.01); H01L 2027/11866 (2013.01); H01L 2027/11875 (2013.01); H01L 2027/11881 (2013.01); H01L 2027/11885 (2013.01);
Abstract

A device comprising a semiconductor substrate. The device also comprising a digital block defined on the substrate and having multiple electronic elements. The device also comprises first and second poly layers coupling to the multiple electronic elements, the first and second poly layers extending in parallel through the digital block in a first direction. The device further comprising a third poly layer coupled to the first poly layer and extending through a gap in the second poly layer in a second direction orthogonal to the first direction poly.


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