The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2024
Filed:
Jan. 04, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
Disclosed is a semiconductor package device comprising a semiconductor chip including first and second chip pads on an active surface of the semiconductor chip, and a redistribution substrate on the first and second chip pads. The redistribution substrate includes first and second redistribution patterns sequentially stacked on the active surface. The first redistribution pattern includes a first via part and a first via pad part vertically overlapping the first via part. The second redistribution pattern includes a second via part and a second via pad part vertically overlapping the second via part. The first via part contacts the first chip pad. The second via part contacts the second chip pad. A length of the second via part is greater than that of the first via part.