The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2024

Filed:

Jun. 29, 2022
Applicant:

Nikon Corporation, Tokyo, JP;

Inventor:

Yuichi Shibazaki, Kumagaya, JP;

Assignee:

NIKON CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 9/00 (2006.01); G01B 11/00 (2006.01); G01B 11/14 (2006.01); G03F 7/00 (2006.01); H01L 21/68 (2006.01);
U.S. Cl.
CPC ...
G03F 9/7046 (2013.01); G01B 11/00 (2013.01); G01B 11/14 (2013.01); G03F 7/70716 (2013.01); G03F 7/70875 (2013.01); G03F 7/70991 (2013.01); G03F 9/7003 (2013.01); H01L 21/68 (2013.01);
Abstract

A lithography system is provided with: a measurement device measuring position information of marks on a substrate held in a first stage; and an exposure apparatus on a second stage, the substrate for which the position information measurement for the marks has been completed, performs alignment measurement to measure position information for part of marks selected from among the marks on the substrate, and performs exposure. The measurement device measures position information of marks on the substrate to obtain higher-degree components of correction amounts of an arrangement of divided areas, and the exposure apparatus measures position information of a small number of marks on the substrate to obtain lower-degree components of the correction amounts of the arrangement of the divided areas and exposes the plurality of divided areas while controlling the position of the substrate by using the obtained lower-degree components and the higher-degree components obtained by the measurement device.


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