The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2024
Filed:
Feb. 06, 2018
Hitachi High-tech Corporation, Tokyo, JP;
Tomohisa Ohtaki, Tokyo, JP;
Takayuki Mizuno, Tokyo, JP;
Ryo Hirano, Tokyo, JP;
Toru Fujimura, Tokyo, JP;
Shigehiko Kato, Tokyo, JP;
Yasuhiko Nara, Tokyo, JP;
Katsuo Ohki, Tokyo, JP;
Akira Kageyama, Tokyo, JP;
Masaaki Komori, Tokyo, JP;
Hitachi High-Tech Corporation, Tokyo, JP;
Abstract
A method for manufacturing a semiconductor device in which probes and the layout of the electrode pads of a test element group (TEG) are associated is provided. As a semiconductor device is miniaturized, a scribe area on a wafer also tends to decrease. Accordingly, it is necessary to reduce the size of a TEG arranged in the scribe area, and efficiently arrange an electrode pad for probe contact. Thus, it is necessary to associate the probes and the layout of the electrode pad. According to the method, a layout of a TEG electrode pad corresponding to a plurality of probes arranged in a fan shape or probes manufactured by Micro Electro Mechanical Systems (MEMS) technology is provided.