The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2024

Filed:

Jun. 13, 2022
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Clemens Jurgschat, Ehningen, DE;

Torsten Ohms, Vaihingen/Enz-Aurich, DE;

Assignee:

ROBERT BOSCH GMBH, Stuttgart, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01L 1/00 (2006.01); G01L 25/00 (2006.01);
U.S. Cl.
CPC ...
G01L 1/005 (2013.01); G01L 25/00 (2013.01);
Abstract

A module, including at least one first component in the form of a semiconductor component including multiple stress measuring cells situated in a distributed manner for detecting stress measured values at different measuring positions of the semiconductor component, at least one second component which is mechanically coupled to the semiconductor component, and an evaluation unit, which is designed to ascertain at least one location-dependent stress distribution in the semiconductor component based on the stress measured values detected at one measuring point in time, and to ascertain a deformation state of the at least one second component at the measuring point in time on the basis of the at least one ascertained location-dependent stress distribution in the semiconductor component. A corresponding method for monitoring environmental influences on a module is also described.


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