The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2024
Filed:
Nov. 06, 2018
Applicant:
Sanyo Special Steel Co., Ltd., Himeji, JP;
Inventors:
Assignee:
Sanyo Special Steel Co., Ltd., Himeji, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/00 (2006.01); B22F 1/052 (2022.01); B33Y 70/00 (2020.01); C22C 1/04 (2023.01); C22C 1/047 (2023.01); B22F 10/28 (2021.01); B22F 10/36 (2021.01); B22F 10/64 (2021.01);
U.S. Cl.
CPC ...
C22C 1/0425 (2013.01); B22F 1/052 (2022.01); B33Y 70/00 (2014.12); C22C 1/047 (2023.01); B22F 10/28 (2021.01); B22F 10/36 (2021.01); B22F 10/64 (2021.01); C22C 9/00 (2013.01);
Abstract
A Cu-based alloy powder is provided that is suitable for a process involving rapid-melting and rapid-solidification and can produce a shaped article having superior properties. The powder is made of a Cu-based alloy. The Cu-based alloy includes 0.1 to 5.0 mass % of at least one element M selected from V, Fe, Zr, Nb, Hf, and Ta. The balance in the alloy is Cu and inevitable impurities. The powder has a ratio D50/TD of a mean particle diameter D50 (μm) to a tap density TD (Mg/m) in a range of 0.2×10·m/Mg to 20×10·m/Mg.