The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2024
Filed:
Jul. 15, 2022
Applicant:
Ormco Corporation, Orange, CA (US);
Inventors:
Byung Jun Ahn, Goleta, CA (US);
Bruce H. Lipshutz, Santa Barbara, CA (US);
Sam L. Nguyen, Saratoga, CA (US);
Roscoe Linstadt, Palo Alto, CA (US);
Assignee:
Ormco Corporation, Orange, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09D 7/63 (2018.01); A61K 6/20 (2020.01); A61K 6/62 (2020.01); A61K 6/65 (2020.01); A61K 6/78 (2020.01); B05D 3/00 (2006.01); B05D 3/10 (2006.01); C07C 69/01 (2006.01); C07C 205/42 (2006.01); C07C 205/43 (2006.01); C07C 235/06 (2006.01); C07C 235/20 (2006.01); C07C 271/16 (2006.01); C07D 217/16 (2006.01); C07F 7/08 (2006.01); C07F 9/12 (2006.01); C07F 9/62 (2006.01); C09D 5/00 (2006.01); C08K 5/107 (2006.01); C08K 5/13 (2006.01);
U.S. Cl.
CPC ...
C09D 7/63 (2018.01); A61K 6/20 (2020.01); A61K 6/62 (2020.01); A61K 6/65 (2020.01); A61K 6/78 (2020.01); B05D 3/002 (2013.01); B05D 3/10 (2013.01); B05D 3/107 (2013.01); C07C 69/01 (2013.01); C07C 205/42 (2013.01); C07C 205/43 (2013.01); C07C 235/06 (2013.01); C07C 235/20 (2013.01); C07C 271/16 (2013.01); C07D 217/16 (2013.01); C07F 7/0896 (2013.01); C07F 9/12 (2013.01); C07F 9/62 (2013.01); C09D 5/002 (2013.01); C08K 5/107 (2013.01); C08K 5/13 (2013.01);
Abstract
In one embodiment, the present application discloses a photo-cleavable surface binding compound of the Formula I and Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound.