The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2024
Filed:
Feb. 18, 2020
Arizona Board of Regents on Behalf of Arizona State University, Scottsdale, AZ (US);
Cody Friesen, Fort McDowell, AZ (US);
Jose Antonio Bautista-Martinez, Mesa, AZ (US);
Mykhaylo Goncharenko, Scottsdale, AZ (US);
Paul Johnson, Phoenix, AZ (US);
Arizona Board of Regents on behalf of Arizona State University, Scottsdale, AZ (US);
Abstract
Solvent free epoxy systems are disclosed that can include a hardener compound H comprising: a molecular structure (R—(Y)n), wherein Ris an ionic moiety, Yis a nucleophilic group, n is a between 2 and 10; and an ionic moiety A acting as a counter ion to R; and an epoxy compound E comprising: a molecular structure (R—Z)n), wherein Ris an ionic moiety, Zcomprises an epoxide group, n is a between 2 and 10, and an ionic moiety B acting as a counter ion to R. In embodiments, the epoxy compound E and/or the hardener H is comprised in a solvent-less ionic liquid. The systems can further include accelerators, crosslinkers, plasticizers, inhibitors, ionic hydrophobic and/or super-hydrophobic compounds, ionic hydrophilic compounds, ionic transitional hydrophobic/hydrophilic compounds, biological active compounds, and/or plasticizer compounds. Polymers made from the disclosed epoxy systems and their methods of use are described.