The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2024
Filed:
Feb. 08, 2016
Applicant:
Huntsman Advanced Materials Licensing (Switzerland) Gmbh, Basel, CH;
Inventors:
Assignee:
HUNTSMAN ADVANCED MATERIALS (Switz, Basel, CH;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08G 18/69 (2006.01); C08G 18/08 (2006.01); C08G 18/18 (2006.01); C08G 18/20 (2006.01); C08G 18/24 (2006.01); C08G 18/40 (2006.01); C08G 18/42 (2006.01); C08G 18/48 (2006.01); C08G 18/62 (2006.01); C08G 18/76 (2006.01); C08J 9/00 (2006.01); C08J 9/12 (2006.01); C08L 19/00 (2006.01); H01B 3/42 (2006.01); C08K 3/36 (2006.01);
U.S. Cl.
CPC ...
C08G 18/698 (2013.01); C08G 18/0871 (2013.01); C08G 18/088 (2013.01); C08G 18/14 (2013.01); C08G 18/18 (2013.01); C08G 18/2081 (2013.01); C08G 18/246 (2013.01); C08G 18/4018 (2013.01); C08G 18/42 (2013.01); C08G 18/4233 (2013.01); C08G 18/4812 (2013.01); C08G 18/4837 (2013.01); C08G 18/485 (2013.01); C08G 18/4883 (2013.01); C08G 18/4887 (2013.01); C08G 18/62 (2013.01); C08G 18/69 (2013.01); C08G 18/7664 (2013.01); C08G 18/7671 (2013.01); C08J 9/0061 (2013.01); C08J 9/122 (2013.01); C08L 19/006 (2013.01); H01B 3/421 (2013.01); H01B 3/427 (2013.01); C08G 2110/0008 (2021.01); C08J 2205/06 (2013.01); C08J 2375/08 (2013.01); C08J 2483/12 (2013.01); C08K 3/36 (2013.01);
Abstract
A composition comprising can be used for the preparation of PUR foam which distinguishes by low-temperature flexibility and low dielectric loss and is suitable for filling the gap between the condenser core and the outer composite or porcelain insulator in the manufacture of resin impregnated paper (RIP) bushings.