The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2024

Filed:

Dec. 20, 2019
Applicant:

Kyushu University, National University Corporation, Fukuoka, JP;

Inventor:

Shigeru Fujino, Fukuoka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03B 19/01 (2006.01); B22F 1/10 (2022.01); B33Y 10/00 (2015.01); B33Y 70/10 (2020.01); C03B 19/06 (2006.01); C03C 1/02 (2006.01); C03C 3/06 (2006.01); C08K 3/36 (2006.01);
U.S. Cl.
CPC ...
C03B 19/01 (2013.01); B33Y 10/00 (2014.12); B33Y 70/10 (2020.01); C03B 19/06 (2013.01); C03C 1/026 (2013.01); C03C 3/06 (2013.01); C08K 3/36 (2013.01); B22F 1/10 (2022.01); C03C 2201/02 (2013.01); C03C 2203/34 (2013.01); C03C 2204/00 (2013.01);
Abstract

A resin composition for inorganic molded article production use, which is provided with inorganic particles each containing amorphous SiOand a photocurable resin composition, in which the photocurable resin composition contains a photocurable resin precursor and a photopolymerization initiator, the content of the inorganic particles is 60% by mass or more with respect to the total amount of the photocurable resin composition and the inorganic particles and is 60% by mass or more with respect to the entire amount of the resin composition for inorganic molded article production use, and the viscosity of the composition for inorganic molded article production use is 10000 mPa·s or less.


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