The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2024

Filed:

Dec. 16, 2020
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Peng Wang, San Diego, CA (US);

Don Le, San Diego, CA (US);

Jon James Anderson, Andover, MA (US);

Chinchuan Chiu, Poway, CA (US);

Assignee:

QUALCOMM INCORPORATED, San Diego, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B64D 13/00 (2006.01); B64C 39/02 (2023.01); B64D 33/08 (2006.01); B64U 10/13 (2023.01); B64U 30/20 (2023.01); F28D 15/02 (2006.01); F28D 15/04 (2006.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
B64D 13/006 (2013.01); B64C 39/024 (2013.01); B64D 33/08 (2013.01); F28D 15/0275 (2013.01); F28D 15/04 (2013.01); B64U 10/13 (2023.01); B64U 30/20 (2023.01); F28D 2021/0021 (2013.01);
Abstract

An innovative passive cooling solution with sealed UAV enclosure system allows heat from a semiconductor chip to be dissipated to the ambient environment through evaporation/condensation phase-change cooling and air cooling a heat sink such as a fin without any additional power consumption to operate cooling solution. One example of such a solution may include a pipe with a fin and a fluid. The pipe may include a wick structure along an inner surface of the pipe configured to allow the fluid to travel within the wick structure and to allow a vapor form of the fluid to exit the wick structure towards a center of the pipe.


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