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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11975511 B1

PDFFull Text
Date of Patent:
May. 07, 2024

Filed:

Sep. 26, 2019

In-mold label, and container with in-mold label

Applicant:

Yupo Corporation, Tokyo, JP;

Inventors:

Shunsuke Honda, Ibaraki, JP;

Takuya Ikarashi, Ibaraki, JP;

Assignee:

YUPO CORPORATION, Tokyo, JP;

Attorney:

GREENBLUM & BERNSTEIN, P.L.C.

Primary Examiner:

David R Dunn

Assistant Examiner:

Christopher E Veraa

Int. Cl.
CPC ...
B32B 27/08 (2006.01); B32B 27/16 (2006.01); B32B 27/20 (2006.01); B32B 27/32 (2006.01); B65D 23/08 (2006.01); G09F 3/02 (2006.01); G09F 3/10 (2006.01);
U.S. Cl.
CPC ...
B32B 27/08 (2013.01); B32B 27/16 (2013.01); B32B 27/20 (2013.01); B32B 27/327 (2013.01); B65D 23/0821 (2013.01); G09F 3/02 (2013.01); G09F 3/10 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2264/1022 (2020.08); B32B 2264/104 (2013.01); B32B 2307/31 (2013.01); B32B 2307/402 (2013.01); B32B 2307/41 (2013.01); B32B 2307/518 (2013.01); B32B 2439/00 (2013.01); B32B 2519/00 (2013.01); G09F 2003/023 (2013.01); G09F 2003/0257 (2013.01); G09F 2003/0272 (2013.01);
Abstract

A decrease in the adhesiveness of an in-mold label can be suppressed even when a silicone transferred from the protective layer side to the heat-sealable resin layer side. An in-mold label includes a substrate layer, a printed layer provided on one surface of the substrate layer, and a heat-sealable resin layer provided on the other surface of the substrate layer, a protective layer containing a silicone is provided on an outermost surface on one surface side of the substrate layer on which the printed layer is provided, and an adhesive strength decrease-inhibiting layer containing a (meth)acrylic acid based copolymer having a polar group is provided on an outermost surface on the other surface side of the substrate layer on which the heat-sealable resin layer is provided.

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