IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11975477 B1

PDFFull Text
Date of Patent:
May. 07, 2024

Filed:

Jul. 21, 2022

Multiphenylethynyl-containing and lightly crosslinked polyimides capable of memorizing shapes and augmenting thermomechanical stability

Applicant:

Government of the United States, As Represented BY the Secretary of the Air Force, Wright-Patterson AFB, OH (US);

Inventors:

Loon-Seng Tan, Centerville, OH (US);

David H. Wang, Beavercreek, OH (US);

Zhenning Yu, Beavercreek, OH (US);

Assignee:

United States of America as represented by the Secretary of the Air Force, Wright-Patterson AFB, OH (US);

Attorneys:

AFMCLO/JAZ

James F. McBride

Primary Examiner:

Jared Barsky

Int. Cl.
CPC ...
B29C 35/02 (2006.01); B29C 41/00 (2006.01); B29C 41/02 (2006.01); B29C 41/12 (2006.01); B29C 41/42 (2006.01); B29C 41/46 (2006.01); B29C 53/00 (2006.01); B29C 53/04 (2006.01); C08G 73/10 (2006.01); C08G 73/12 (2006.01); C08G 73/14 (2006.01); C08J 5/02 (2006.01); B29K 79/00 (2006.01); B29K 105/00 (2006.01); B29K 105/24 (2006.01);
U.S. Cl.
CPC ...
B29C 53/005 (2013.01); B29C 35/02 (2013.01); B29C 41/003 (2013.01); B29C 41/02 (2013.01); B29C 41/12 (2013.01); B29C 41/42 (2013.01); B29C 41/46 (2013.01); B29C 53/04 (2013.01); C08G 73/101 (2013.01); C08G 73/1067 (2013.01); C08G 73/1071 (2013.01); C08G 73/121 (2013.01); C08G 73/124 (2013.01); C08G 73/14 (2013.01); C08J 5/02 (2013.01); B29C 2791/001 (2013.01); B29C 2791/004 (2013.01); B29K 2079/08 (2013.01); B29K 2105/0061 (2013.01); B29K 2105/24 (2013.01); B29K 2995/0094 (2013.01); C08G 73/127 (2013.01); C08G 2220/00 (2013.01); C08G 2280/00 (2013.01); C08J 2379/08 (2013.01); C08L 2201/12 (2013.01);
Abstract

The invention generally relates to shape memory films that are tri-functionally crosslinked and that comprise multiple, non-terminal, phenylethynyl moieties. In addition, the present invention relates methods of fabricating such films. Due to the improved properties of such SMPs, the SMP designer can program in to the SMP thermomechanical property enhancements that make the SMP suitable, among other things, for advanced sensors, high temperature actuators, responder matrix materials and heat responsive packaging.

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