The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2024
Filed:
Jul. 26, 2019
Applicant:
Hewlett-packard Development Company, L.p., Spring, TX (US);
Inventors:
Chien-Hua Chen, Corvallis, OR (US);
Si-lam J. Choy, Corvallis, OR (US);
Michael W. Cumbie, Corvallis, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/00 (2006.01); B29C 45/14 (2006.01); B29C 45/32 (2006.01); B41J 2/16 (2006.01); B29K 63/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14508 (2013.01); B29C 45/14065 (2013.01); B29C 45/322 (2013.01); B41J 2/1601 (2013.01); B41J 2/1637 (2013.01); B29K 2063/00 (2013.01); B29K 2995/0012 (2013.01); B29L 2031/767 (2013.01);
Abstract
In various examples, a printbar is formed from multiple modular fluid ejection subassemblies joined together through a molding process that provides for a continuous planar substrate surface. A mold may secure the modular fluid ejection subassemblies during a molding process in which a runner conveys a molding material to seams between the joined modular fluid ejection subassemblies.