The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2024

Filed:

Dec. 18, 2020
Applicant:

Sms Group Gmbh, Düsseldorf, DE;

Inventors:

Jens Artel, Kirchhundem, DE;

Sebastian Seegers, Niederkassel, DE;

Christian Dornscheidt, Düsseldorf, DE;

Lutz Kümmel, Jüchen, DE;

Jens Szonn, Düsseldorf, DE;

Assignee:

SMS group GmbH, Düsseldorf, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/211 (2014.01); B23K 26/32 (2014.01); B23K 35/02 (2006.01); B23K 35/22 (2006.01); B23K 101/16 (2006.01); B23K 101/18 (2006.01); B23K 103/04 (2006.01);
U.S. Cl.
CPC ...
B23K 26/211 (2015.10); B23K 26/32 (2013.01); B23K 35/0244 (2013.01); B23K 35/0261 (2013.01); B23K 35/22 (2013.01); B23K 2101/16 (2018.08); B23K 2101/18 (2018.08); B23K 2103/04 (2018.08);
Abstract

A butt joint deep penetration laser welding method is used for joining facing end sections of flat steel products, each having a carbon content CS<0.02%. In order to improve such a method such that an improved weld quality in terms of geometry and strength is achievable with it, at least one carbon-containing carrier material is inserted into a butt joint gap between the end sections, the carbon content of which is C≥20·C, preferably C≥100·C, and/or carbon is inserted into the butt joint gap or applied to at least one end section, such that the volume of the carbon inserted into the butt joint gap corresponds to 1% to 20% of the volume of a melt produced by a butt joint deep penetration laser welding process.


Find Patent Forward Citations

Loading…