The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2024
Filed:
May. 17, 2021
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Amin Ahmad Sijelmassi, Dallas, TX (US);
Bradley Glasscock, Wylie, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); B23K 20/00 (2006.01); B23K 20/04 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/34 (2006.01); H01L 23/48 (2006.01); H01L 23/485 (2006.01); H01L 23/495 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/40 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
B23K 20/004 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/78 (2013.01); H01L 24/85 (2013.01); H01L 2224/45014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/14 (2013.01);
Abstract
In a described example, an electrical apparatus includes a substrate having a first surface and lead pads on the first surface of the substrate for surface mounting components. A ribbon wire bond is provided having open ends and a central portion between the open ends, the open ends of the ribbon wire bond connected to the lead pads. An electrical component is bonded to the central portion of the ribbon wire bond. The central portion of the ribbon wire bond and the electrical component are spaced from the first surface of the substrate.