The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2024

Filed:

Jun. 15, 2023
Applicant:

Mycoworks, Inc., Emeryville, CA (US);

Inventors:

Philip Ross, San Francisco, CA (US);

Matthew L. Scullin, San Francisco, CA (US);

Nicholas Wenner, Sebastopol, CA (US);

Jordan Chase, Oakland, CA (US);

Quinn Miller, Berkeley, CA (US);

Ryan Salditos, San Francisco, CA (US);

Phil McGaughy, Oakland, CA (US);

Assignee:

MycoWorks, Inc., Emeryville, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
A01G 18/22 (2018.01); A01G 18/62 (2018.01); A01G 18/64 (2018.01); A01G 18/65 (2018.01); C12M 1/12 (2006.01); C12N 5/00 (2006.01);
U.S. Cl.
CPC ...
A01G 18/62 (2018.02); A01G 18/22 (2018.02); A01G 18/64 (2018.02); A01G 18/65 (2018.02); C12M 25/14 (2013.01); C12N 5/0068 (2013.01); C12N 2533/90 (2013.01);
Abstract

A mycelium growth bed for growing a solid substrate-bound mycelium through which the mycelium composite is easily and readily removed. This is achieved through the use of a perforation layer embedded between the mycelium substrate and the mycelium composite so as to create a uniform structural weakness and thereby enhancing harvesting abilities of the ex-substrate mycelium via a greatly reduced and uniform tear strength. The perforation layer, through which the mycelium grows, allows for the gated and controlled extrusion of a matrix of colonial cells that may be easily and uniformly delaminated from the underlying mycelium substrate.


Find Patent Forward Citations

Loading…