The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2024

Filed:

Feb. 10, 2022
Applicant:

The Regents of the University of Colorado, Denver, CO (US);

Inventors:

Jianliang Xiao, Louisville, CO (US);

Yan Sun, Boulder, CO (US);

Wei Ren, Boulder, CO (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10N 10/01 (2023.01); H01L 25/04 (2023.01); H01L 25/065 (2023.01); H05K 1/02 (2006.01); H10N 10/17 (2023.01);
U.S. Cl.
CPC ...
H10N 10/01 (2023.02); H01L 25/04 (2013.01); H01L 25/0655 (2013.01); H05K 1/0283 (2013.01); H10N 10/17 (2023.02);
Abstract

Soft motherboards having rigid plugin modules are described herein. In one aspect of the present disclosure, an electronic device can include a polymeric substrate having: a plurality of slots, each configured for receiving an electronic module; one or more electrical junctions including a stretchable conductive interconnect electronically coupling a slot to another slot of the plurality of slots; and at least one electronic module including: a film configured to: support other components of the electronic module; and be inserted, and be partially housed in, one of the plurality of slots of the polymeric substrate; and at least one electrode coupled to the film and positioned to be in contact with a corresponding electrical junction of the polymeric substrate when the film is partially housed in the polymeric substrate.


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