The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2024

Filed:

Aug. 23, 2019
Applicant:

Hewlett Packard Enterprise Development Lp, Houston, TX (US);

Inventors:

Ernesto Ferrer Medina, Aguadilla, PR;

Harvey J. Lunsman, Chippewa Falls, WI (US);

Tahir Cader, Liberty Lake, WA (US);

John Franz, Houston, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/20 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20509 (2013.01); G06F 1/20 (2013.01); H05K 1/0203 (2013.01);
Abstract

A circuit board cooling apparatus is disclosed having a heat spreader device to be thermally coupled with a surface of the circuit board to be cooled. Also, a conforming heat transfer device is disclosed that is thermally and physically coupled with the heat spreader device to conform to a surface contour of the heat spreader device on a first side of the heat transfer device. The cooling apparatus also includes a heat transport device physically attached and thermally coupled with a second side of the heat transfer device.


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