The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2024
Filed:
Aug. 17, 2022
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/02 (2006.01); B32B 1/00 (2006.01); B32B 3/26 (2006.01); B32B 3/30 (2006.01); B32B 5/02 (2006.01); B32B 7/022 (2019.01); B32B 7/12 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 15/08 (2006.01); B32B 15/14 (2006.01); B32B 17/06 (2006.01); B32B 17/10 (2006.01); B32B 27/28 (2006.01); B32B 37/06 (2006.01); B32B 37/10 (2006.01); B32B 38/00 (2006.01);
U.S. Cl.
CPC ...
H05K 5/02 (2013.01); B32B 1/00 (2013.01); B32B 3/266 (2013.01); B32B 3/30 (2013.01); B32B 5/02 (2013.01); B32B 7/022 (2019.01); B32B 7/12 (2013.01); B32B 9/005 (2013.01); B32B 9/045 (2013.01); B32B 9/047 (2013.01); B32B 15/08 (2013.01); B32B 15/14 (2013.01); B32B 17/067 (2013.01); B32B 17/10 (2013.01); B32B 27/283 (2013.01); B32B 37/06 (2013.01); B32B 37/10 (2013.01); B32B 38/0036 (2013.01); B32B 2038/0048 (2013.01); B32B 2250/03 (2013.01); B32B 2255/02 (2013.01); B32B 2255/10 (2013.01); B32B 2255/20 (2013.01); B32B 2262/105 (2013.01); B32B 2307/306 (2013.01); B32B 2307/51 (2013.01); B32B 2307/538 (2013.01); B32B 2307/54 (2013.01); B32B 2307/734 (2013.01); B32B 2315/08 (2013.01); B32B 2457/00 (2013.01);
Abstract
An electronic device housing, and an electronic device including the same are provided. The electronic device housing includes a substrate including glass, an insert portion which is bonded to the substrate at a surface of the insert portion, and at which a functional component of an electronic device having the electronic device housing is disposed, and an elastic layer which is between the substrate and the insert portion and extends along the surface of the insert portion.