The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2024
Filed:
Nov. 16, 2021
Applicant:
Toppan Inc., Tokyo, JP;
Inventors:
Yuki Nitta, Tokyo, JP;
Takeshi Tamura, Tokyo, JP;
Masashi Sawadaishi, Tokyo, JP;
Takashi Fujita, Tokyo, JP;
Assignee:
TOPPAN INC., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H01L 23/14 (2006.01); H01L 23/32 (2006.01); H05K 1/14 (2006.01); H05K 3/28 (2006.01); H05K 3/30 (2006.01); H05K 3/34 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 3/46 (2013.01); H01L 23/142 (2013.01); H01L 23/32 (2013.01); H05K 1/14 (2013.01); H05K 3/284 (2013.01); H05K 3/305 (2013.01); H05K 3/3436 (2013.01); H05K 3/36 (2013.01); H05K 2201/10378 (2013.01);
Abstract
There is provided a method of producing circuit boards, including a bonding step of bonding joints of an FC-BGA circuit board component with respective joints of an interposer, followed by a resin supply step of filling an underfill in a gap between the FC-BGA circuit board component and the interposer, a resin curing step of curing the underfill, and a support release step of releasing a support from the interposer, which are performed through a sequence of the support release step, the resin supply step, and the resin curing step.