The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2024
Filed:
Sep. 22, 2021
Applicant:
Denso Corporation, Kariya, JP;
Inventors:
Hiroyoshi Kunieda, Kariya, JP;
Hiroki Hayashi, Kariya, JP;
Assignee:
DENSO CORPORATION, Kariya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 2201/10734 (2013.01);
Abstract
An electronic device includes an upper package including an upper chip, a lower package including a lower chip, a printed circuit board above which the upper package and the lower package are laminated, solder balls connecting the upper package and the lower package, solder balls connecting the lower package and the printed circuit board. The lower package has a thermal expansion coefficient set between a thermal expansion coefficient of the upper package and a thermal expansion coefficient of the printed circuit board.