The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2024

Filed:

Jul. 02, 2019
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Naoki Kosaka, Tokyo, JP;

Ayumi Fuchida, Tokyo, JP;

Masaaki Shimada, Tokyo, JP;

Go Sakaino, Tokyo, JP;

Tadashi Takase, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 10/00 (2013.01); H01S 5/0232 (2021.01); H01S 5/026 (2006.01);
U.S. Cl.
CPC ...
H01S 5/0232 (2021.01); H01S 5/0262 (2013.01);
Abstract

A semiconductor laser device comprises a stem serving as a base; a laser diode LD submount having surface electrodes arranged thereon and joined to the surface of the stem; an LD chip joined to the surface electrode and connected with the surface electrode; and leads fixed in through holes formed in the stem by means of sealing parts and electrically connected to the surface electrodes via embedded layers in via holes formed in the LD submount, wherein grooves are formed in portions of the sealing parts or in portions of the LD submount around the connections between the leads and the embedded layers, to obtain a good modulated light waveform.


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