The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2024

Filed:

Apr. 21, 2021
Applicant:

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventor:

Kuo-Sheng Lee, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06V 40/13 (2022.01); H01L 27/146 (2006.01); H01L 25/16 (2023.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 27/14625 (2013.01); G06V 40/1318 (2022.01); H01L 27/14623 (2013.01); H01L 27/14634 (2013.01); H01L 27/14685 (2013.01); H01L 25/167 (2013.01); H01L 25/18 (2013.01);
Abstract

A fingerprint identification module collimating light reflected by fingertip skin patterns defines a fingerprint identification area and a peripheral area, for identifying fingerprints. The module includes a first light-shielding layer, optical sensors, a second light-shielding layer, a supporting portion, and a gap portion. The first and second light-shielding layers each define through holes (first and second through holes). Each second through hole exposes one optical sensor and is aligned with one first through hole. The supporting portion in the peripheral area bonds the first and second substrates, maintaining a certain distance between the first and second light-shielding layers. The gap portion is in the fingerprint identification area. Light reflected by a fingerprint is collimated by the first through holes, the gap portion, and the second through holes and then received as optical signals by the sensors to realize fingerprint imaging.


Find Patent Forward Citations

Loading…