The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2024
Filed:
Sep. 06, 2022
Applicant:
Depuy Synthes Products, Inc., Raynham, MA (US);
Inventor:
Laurent Blanquart, Westlake Village, CA (US);
Assignee:
DePuy Synthes Products, Inc., Raynham, MA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); A61B 1/00 (2006.01); A61B 1/05 (2006.01); A61B 1/06 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H01L 27/12 (2006.01); H04N 23/56 (2023.01); H04N 25/75 (2023.01); H04N 25/767 (2023.01); H04N 25/772 (2023.01); H04N 25/778 (2023.01); H04N 25/79 (2023.01); H01L 31/028 (2006.01); H01L 31/0296 (2006.01); H01L 31/0304 (2006.01); H04N 23/50 (2023.01);
U.S. Cl.
CPC ...
H01L 27/14603 (2013.01); A61B 1/00009 (2013.01); A61B 1/051 (2013.01); A61B 1/0676 (2013.01); H01L 24/17 (2013.01); H01L 24/20 (2013.01); H01L 24/28 (2013.01); H01L 25/0657 (2013.01); H01L 27/124 (2013.01); H01L 27/146 (2013.01); H01L 27/14601 (2013.01); H01L 27/14609 (2013.01); H01L 27/14618 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/14638 (2013.01); H01L 27/1464 (2013.01); H01L 27/14641 (2013.01); H01L 27/14643 (2013.01); H01L 27/14689 (2013.01); H01L 27/1469 (2013.01); H04N 23/56 (2023.01); H04N 25/75 (2023.01); H04N 25/767 (2023.01); H04N 25/772 (2023.01); H04N 25/778 (2023.01); H04N 25/79 (2023.01); H01L 31/028 (2013.01); H01L 31/0296 (2013.01); H01L 31/0304 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/381 (2013.01); H04N 23/555 (2023.01);
Abstract
Embodiments of a hybrid imaging sensor and methods for pixel sub-column data read from the within a pixel array.