The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2024

Filed:

Jan. 18, 2022
Applicant:

Stroke Precision Advanced Engineering Co., Ltd., Taoyuan, TW;

Inventors:

Yu-Min Huang, Taichung, TW;

Sheng Che Huang, Taichung, TW;

Chingju Lin, Taichung, TW;

Wei-Hao Wang, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 1/005 (2006.01); H01L 23/00 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); B23K 1/0053 (2013.01); B23K 1/0056 (2013.01); H01L 24/80 (2013.01); H01L 24/81 (2013.01); B23K 2101/40 (2018.08); H01L 2224/75263 (2013.01); H01L 2224/75283 (2013.01); H01L 2224/75705 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/80224 (2013.01); H01L 2224/8023 (2013.01); H01L 2224/80815 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81224 (2013.01); H01L 2224/8123 (2013.01); H01L 2224/81815 (2013.01);
Abstract

A method for transferring an electronic device includes steps as follows. A flexible carrier is provided and has a surface with a plurality of electronic devices disposed thereon. A target substrate is provided corresponding to the surface of the flexible carrier. A pin is provided, and a pin end thereof presses on another surface of the flexible carrier without the electronic devices disposed thereon, so that the flexible carrier is deformed, causing at least one of the electronic devices to move toward the target substrate and to be in contact with the target substrate. A beam is provided to transmit at least a portion of the pin and emitted from the pin end to melt a solder. The electronic device is fixed on the target substrate by soldering. The pin is moved to restore the flexible carrier to its original shape, allowing the electronic device fixed by soldering to separate from the carrier.


Find Patent Forward Citations

Huang, Yu-Min. (2024). Method for transferring electronic device (U.S. Patent No. 11973054). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11973054

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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