The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2024

Filed:

Apr. 29, 2020
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Elvir Kahrimanovic, Villach, AT;

Gerhard Noebauer, Villach, AT;

Oliver Blank, Villach, AT;

Alessandro Ferrara, Villach, AT;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 29/417 (2006.01); H01L 29/43 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49844 (2013.01); H01L 23/49513 (2013.01); H01L 23/49562 (2013.01); H01L 24/02 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 29/41741 (2013.01); H01L 29/435 (2013.01); H01L 23/4952 (2013.01); H01L 23/49524 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/40 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/02375 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05083 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05172 (2013.01); H01L 2224/05186 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05686 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06182 (2013.01); H01L 2224/29116 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/05042 (2013.01); H01L 2924/0544 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A semiconductor device includes a semiconductor die having a vertical transistor device with a source electrode, a drain electrode and a gate electrode, the semiconductor die having a first surface and a second surface opposing the first surface. A first metallization structure is located on the first surface and includes at least one source pad coupled to the source electrode, at least one drain pad coupled to the drain electrode and at least one gate pad coupled to the gate electrode, A second metallization structure is electrically insulated from the semiconductor die by the electrically insulating layer.


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