The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2024

Filed:

Jul. 02, 2020
Applicant:

Jian Zhang, Brookline, MA (US);

Inventor:

Jian Zhang, Brookline, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H05K 13/04 (2006.01); H05K 13/08 (2006.01);
U.S. Cl.
CPC ...
H01L 21/681 (2013.01); H01L 21/67144 (2013.01); H01L 21/67259 (2013.01); H01L 21/6838 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/742 (2013.01); H05K 13/0404 (2013.01); H05K 13/0409 (2018.08); H05K 13/0452 (2013.01); H05K 13/046 (2013.01); H05K 13/0465 (2013.01); H05K 13/0812 (2018.08); H05K 13/0882 (2018.08); H01L 2224/11003 (2013.01); H01L 2224/11005 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/117 (2013.01);
Abstract

The present invention features a system and manufacturing arrangement for multiple die chips onto a receiver substrate. The system includes a donor chuck; a receiver chuck configured for supporting the receiver substrate; a pick and place gripper mechanism configured for retrieving a die chip supported on the donor chuck; a gang carrier configured for receiving the die chip from the gripper mechanism; a flipper mechanism configured for delivering the die chip in an inverted orientation relative to the orientation of the die chip when received by the gang carrier; and computer controlled interconnected inspection cameras configured for ensuring accurate alignment of the receiver substrate relative to the die chip in the inverted orientation. The gang carrier has a thermocouple controlled heating element therein to maintain a proper computer controlled temperature therewithin.


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