The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2024
Filed:
Jun. 15, 2020
Applicant:
Semes Co., Ltd., Chungcheongnam-do, KR;
Inventors:
Ohyeol Kwon, Chungcheongnam-do, KR;
Jun Keon Ahn, Sejong-si, KR;
Soo Young Park, Incheon, KR;
Jung Hwan Lee, Gyeonggi-do, KR;
Assignee:
SEMES CO., LTD., Chungcheongnam-Do, KR;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); B23K 26/0622 (2014.01); B23K 26/36 (2014.01); B23K 26/362 (2014.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02098 (2013.01); B23K 26/0624 (2015.10); B23K 26/36 (2013.01); B23K 26/362 (2013.01); H01L 21/02021 (2013.01); H01L 21/02087 (2013.01); H01L 21/67069 (2013.01); H01L 21/67242 (2013.01); H01L 21/67253 (2013.01); H01L 21/68764 (2013.01); H01L 22/12 (2013.01); H01L 22/20 (2013.01);
Abstract
The inventive concept provides a method for treating a substrate. The method includes removing a film on the substrate by applying a pulsed laser to the rotating substrate, in which thickness of the film to be removed is measured and pulse energy of the pulsed laser is selected based on the measured thickness of the film.