The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 30, 2024

Filed:

Jun. 15, 2022
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Satoshi Tani, Nagaokakyo, JP;

Kenichi Oshiumi, Nagaokakyo, JP;

Kazutoyo Horio, Nagaokakyo, JP;

Junichi Sato, Nagaokakyo, JP;

Keiji Yoshida, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/012 (2006.01); H01G 9/10 (2006.01); H01G 9/15 (2006.01); H01G 9/26 (2006.01);
U.S. Cl.
CPC ...
H01G 9/012 (2013.01); H01G 9/10 (2013.01); H01G 9/15 (2013.01); H01G 9/26 (2013.01);
Abstract

A solid electrolytic capacitor that includes a resin molding, a first external electrode, and a second external electrode. The resin molding includes a laminate of multiple capacitor elements, and a sealing resin sealing the laminate. The following are satisfied: t<t, t<t, t<t, and t/t<t/t, where tis the thickness of an inner portion of the cathode lead-out layer, the inner portion not being exposed at the second end surface; tis the thickness of an exposed portion of the cathode lead-out layer, the exposed portion being exposed at the second end surface; tis the thickness of an inner portion of the valve-action metal substrate, the inner portion not being exposed at the first end surface; and tis the thickness of an exposed portion of the valve-action metal substrate, the exposed portion being exposed at the first end surface.


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